Multi-board Design Now

In modern electronics, engineers often transition from single to multi-board systems to meet specific project goals:

Different boards can use different stackups or materials (e.g., high-speed laminates for processing and standard FR4 for power) tailored to their specific function. Key Design Challenges multi-board design

| Interface | Pros | Cons | |-----------|------|------| | | Robust, low profile, high pin count | Cost, mechanical tolerance | | FFC/FPC cable | Flexible, cheap, dense | Fragile, limited current | | Wires (crimp/harness) | Cheap, high current, easy rework | Messy, assembly time | | Rigid-flex | Extremely reliable, saves space | Expensive, long lead time | In modern electronics

The multi-board design approach offers several advantages, including: high pin count | Cost

Common families: Samtec, Hirose DF13/DF63, JST PH/XH, TE AMPMODU, PCIe/M.2 edge connectors.